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| www..com EMIF02-MIC02F2 2-line IPADTM, EMI filter and ESD protection Features EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Lead free package Very low PCB space consuming: 1.42 mm x 0.92 mm Very thin package: 0.65 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reducing of parasitic elements through integration and wafer level packaging Figure 1. Pin configuration (bump side) 3 2 1 Flip Chip (6 bumps) Complies with the following standards I2 GND I1 A IEC 61000-4-2 level 4 on input pins - 15 kV (air discharge) - 8 kV (contact discharge) IEC 61000-4-2 level 1 on input pins - 2 kV (air discharge) - 2 kV (contact discharge) O2 GND O1 B Figure 2. Basic cell configuration Applications Where EMI filtering in ESD sensitive equipment is required: Input Low-pass Filter Output Ri/o = 470 W Cline = 16 pF Mobile phones and communication systems Computers, printers and MCU Boards GND GND GND Description The EMIF02-MIC02 is a highly integrated devices designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 Flip Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents the device from destruction when subjected to ESD surges up 15 kV. TM: IPAD is a trademark of STMicroelectronics. April 2008 Rev 3 1/8 www.st.com 8 Electrical characteristics www..com EMIF02-MIC02F2 1 Electrical characteristics Table 1. Symbol Tj Top Tstg Absolute ratings (Tamb = 25 C) Parameter junction temperature Operating temperature range Storage temperature range Value 125 -40 to +85 -55 to 150 Unit C C C Table 2. Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Symbol VBR IRM RI/O Cline Electrical characteristics (Tamb = 25 C) Parameters Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between input and output Input capacitance per line Test conditions IR = 1 mA VRM = 12 V per line 423 @0V 470 40 Min 14 Typ 16 500 517 45 Max Unit V nA pF IPP VCL VBR VRM IR IRM IRM IR VRM VBR VCL V I IPP 2/8 EMIF02-MIC02F2 www..com Electrical characteristics Figure 3. - 10.00 dB - 15.00 - 20.00 - 25.00 - 30.00 - 35.00 S21 (dB) attenuation measurement Figure 4. and Aplac simulation -20.00 dB -30.00 Measurement Analog crosstalk measurements -40.00 I2/O1 -50.00 -60.00 - 40.00 - 45.00 Simulation -70.00 - 50.00 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M f/Hz 1.0G 3.0G -80.00 1.0M 3.0M 10.0M 30.0M 100.0M f/Hz 300.0M 1.0G 3.0G Figure 5. Digital crosstalk measurement Figure 6. ESD response to IEC61000-4-2 (-15 kV air discharge) on one input V(in) and on one output (Vout) Figure 7. ESD response to IEC61000-4-2 (+15 kV air discharge) on one input V(in) and on one output (Vout) Figure 8. Line capacitance versus applied voltage C(pF) 20 18 16 14 12 10 8 6 4 2 0 0 1 2 3 4 5 6 7 8 9 10 11 12 VR(V) F=1MHz Vosc=30mVRMS Tj=25C 3/8 Application information www..com EMIF02-MIC02F2 2 Application information Figure 9. I1 Aplac model R_470R O1 gnd Cox MODEL = D01-int MODEL = D01-ext Cox 50pH Rsubump MODEL = D01-gnd gnd 50pH Rsubump 50m 50m Rsubump MODEL = D01-ext Cox MODEL = D01-int Rsubump Lgnd Cgnd Cgnd Rgnd O2 Lgnd Cox Rgnd I2 R_470R Figure 10. Aplac parameters Model D01-ext BV = 7 CJO = Cz_ext IBV = 1u IKF = 1000 IS = 10f ISR = 100p N=1 M = 0.3333 RS = Rs_ext VJ = 0.6 TT = 50n Model D01-int BV = 7 CJO = Cz_int IBV = 1u IKF = 1000 IS = 10f ISR = 100p N=1 M = 0.3333 RS = Rs_int VJ = 0.6 TT = 50n Model D01-gnd BV = 7 CJO = Cz_gnd IBV = 1u IKF = 1000 IS = 10f ISR = 100p N=1 M = 0.3333 RS = Rs_gnd VJ = 0.6 TT = 50n Ls 400pH Rs 100m R_470R 482.6 Cz_ext 8.73pF Rs_ext 850m Cz_int 2.9pF Rs_int 850m Cz_gnd 215.61pF Rs_gnd 470m Rgnd 10m Lgnd 48pH Cgnd 0.15pF Cox 3.05pF Rsubump 200m 4/8 EMIF02-MIC02F2 www..com Ordering information scheme 3 Ordering information scheme Figure 11. Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10 pF or 3 letters = application 2 digits = version Package F = Flip Chip x = 2: Lead-free, pitch = 500 m, bump = 315 m yy - xxx zz Fx 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 12. Package dimensions 500 m 50 315 m 50 650m 65 500 m 50 210 m 0.92 mm 50m 210 m 1.42 mm 50 m 5/8 Ordering information www..com EMIF02-MIC02F2 Figure 13. Footprint Figure 14. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) Copper pad Diameter: 250 m recommended, 300 m max Solder stencil opening: 330 m E Solder mask opening recommendation: 340 m min for 300 m copper pad diameter xxz y ww Dot identifying Pin A1 location 4 0.1 O 1.5 0.1 Figure 15. Flip Chip tape and reel specification 1.75 0.1 3.5 0.1 1.02 0.73 0.05 All dimensions in mm 8 0.3 STE STE STE xxz yww User direction of unreeling xxz yww xxz yww 4 0.1 1.47 5 Ordering information Table 3. Ordering information Marking FJ Package Flip Chip Weight 2.3 mg Base qty 5000 Delivery mode Tape and reel 7" Order code EMIF02-MIC02F2 Note: More information is available in the application notes: AN1235:"Flip Chip: Package description and recommendations for use" AN1751: "EMI filters: Recommendations and measurements" 6/8 EMIF02-MIC02F2 www..com Revision history 6 Revision history Table 4. Date 12-Oct-2004 11-Jan-2006 17-Apr-2008 Document revision history Revision 1 2 3 Initial release. ECOPACK statement added. Die dimensions modified in Figure 12. and first page. Typographical errors corrected. Updated ECOPACK statement. Updated Figure 11, Figure 12 and Figure 15. Reformatted to current standards. Changes 7/8 www..com EMIF02-MIC02F2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 |
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